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PCB assembly built for high-mix, low-volume.
Surface-mount and through-hole assembly across three SMT lines, to IPC-A-610 and J-STD-001 Class 2 & 3 — from a single prototype board to 10,000+ piece production runs.
Overview
Where failure isn't an option, we're already qualified.
Quantity is never the obstacle: SEI builds 1 piece to 10,000+ with the same documented process control, and there are no practical minimum or maximum board size constraints for the work we quote. We support turnkey, consigned, and mixed material models — whichever fits your supply chain. Every board runs through an integrated inspection flow: solder paste inspection built into the printer, on-machine 2D component verification, 3D AOI, and X-ray for hidden-joint packages.
3 SMT LINES
CLASS 2 / 3
TURNKEY · CONSIGNED · MIXED
FULL TRACEABILITY
- VOLUME1 to 10,000+ piecesPrototype, low-volume, and production runs on the same lines
- MATERIALTurnkey / consigned / mixedFull procurement, customer-supplied, or any blend
- TECHSMT + through-hole + mixedFine-pitch, BGA, QFN; selective solder and hand assembly to Class 2 & 3
- PROCESSLead-free & SnPbBoth alloys supported with closed-loop reflow control
- INSPECTIONSPI → 2D → 3D AOI → X-rayIntegrated paste inspection through microfocus X-ray for BGA/QFN
- STANDARDIPC-A-610 / J-STD-001 Class 2 & 3Certified IPC Trainer on staff; all operators trained & certified
SMT LINE · SCREEN PRINT THROUGH REFLOW
FINE-PITCH SMT ASSEMBLY